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FDS4675 - onsemi

Description: High power and current handling capability; -11A, -40 V. ; High performance trench technology for extremelylow RDS(ON); Fast switching speed; RDS(ON) = 0.013 Ω @ VGS = -10 V; RDS(ON) = 0.017 Ω @ VGS = -4.5 V

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FDS4675 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC8-2
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FDS4675 - onsemi  - 3D model - Small Outline Packages - SOIC8-2
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FDS4675 Details

  • Manufacturer Part Number:

    FDS4675

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOP-8

  • Manufacturer Package Code:

    751EB

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    11 A

  • Drain-source On Resistance-Max:

    0.013 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    290 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    2.4 W

  • Pulsed Drain Current-Max (IDM):

    50 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    248 ns

  • Turn-on Time-Max (ton):

    82 ns

FDS4675 Frequently Asked Questions (FAQs)

  • The FDS4675 can operate from -40°C to 150°C, making it suitable for high-reliability applications.
  • To ensure proper biasing, connect the VCC pin to a stable 5V power supply, and the VEE pin to a stable -5V power supply. Also, ensure the input voltage (VIN) is within the recommended range of 2.5V to 5.5V.
  • To minimize noise and ensure optimal performance, use a multi-layer PCB with a solid ground plane, keep the input and output traces short and separate, and use a decoupling capacitor (e.g., 100nF) between VCC and GND.
  • To prevent ESD damage, use ESD-protective equipment, such as wrist straps and mats, when handling the FDS4675. Also, ensure the PCB design includes ESD protection diodes and resistors to prevent voltage spikes.
  • To prevent overheating, ensure good airflow around the device, use a heat sink if necessary, and avoid blocking the thermal pad on the bottom of the package. Also, follow the recommended thermal design guidelines in the datasheet.

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Part Image FDS4675 Fairchild Semiconductor Corporation

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Part Image FDS4675_NL Fairchild Semiconductor Corporation

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