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FDS8882 - onsemi

Description: Last Shipments - Dual N & P-Channel Enhancement Mode Field Effect Transistor

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FDS8882 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - SOIC8 CASE 751EB
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FDS8882 - onsemi  - 3D model - Small Outline Packages - SOIC8 CASE 751EB
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FDS8882 Details

  • Manufacturer Part Number:

    FDS8882

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOP-8

  • Manufacturer Package Code:

    751EB

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    ULTRA LOW RESISTANCE

  • Avalanche Energy Rating (Eas):

    32 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    9 A

  • Drain-source On Resistance-Max:

    0.02 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2.5 W

  • Pulsed Drain Current-Max (IDM):

    21 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDS8882 Frequently Asked Questions (FAQs)

  • A good PCB layout for FDS8882 involves keeping the high-current paths short and wide, using a solid ground plane, and placing the device close to the load. Additionally, it's recommended to use a shielded inductor and to keep the switching node (SW) away from sensitive analog circuits.
  • To optimize the compensation network, start by following the datasheet's recommended values for RCOMP and CCOMP. Then, use a Bode plot or a network analyzer to measure the loop gain and adjust the compensation network to achieve a stable response with sufficient phase margin.
  • The maximum junction temperature (Tj) for the FDS8882 is 150°C. However, it's recommended to keep the junction temperature below 125°C for reliable operation and to avoid thermal shutdown.
  • Yes, the FDS8882 can be used in a synchronous rectification configuration. However, it's essential to ensure that the synchronous rectifier is properly synchronized with the FDS8882's switching frequency and that the rectifier's voltage rating is sufficient for the application.
  • To troubleshoot the OCP feature, start by checking the current sense resistor (RSENSE) value and ensuring it's within the recommended range. Then, verify that the OCP threshold is set correctly and that the device is not overheating. If the issue persists, check for any layout or component issues that may be causing false OCP triggers.

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FDS8882 Overview

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