A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure proper PCB design, and consider using a thermistor or thermocouple for temperature monitoring.
Use a shielded enclosure, and ensure proper PCB layout and grounding. Implement EMI filters, and consider using a common-mode choke and ferrite beads to reduce emissions.
Implement a power-saving mode, and consider using a low-dropout regulator (LDO) or a switching regulator with a low quiescent current. Optimize the system's power management scheme to minimize standby power consumption.
Use a 4-wire Kelvin connection for accurate voltage and current measurements. Ensure proper probe placement and consider using a high-impedance probe to minimize loading effects.
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FDWS86380-F085 Overview
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