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FDY4000CZ - onsemi

Description: ESD Protection Diode (note 3); Q2 P-Channel Max. RDS(on) = 1.2 Ω at VGS = -4.5 V, ID = -350 mA Max. RDS(on) = 1.6 Ω at VGS = -2.5 V, ID = -300 mA Max. RDS(on) = 2.7 Ω at VGS = -1.8 V, ID = -150 mA; RoHS Compliant; Q1 N-Channel Max. RDS(on) = 0.7 Ω at VGS = 4.5 V, ID = 600 mA Max. RDS(on) = 0.85 Ω at VGS = 2.5 V, ID = 500 mA Max. RDS(on) = 1.25 Ω at VGS = 1.8 V, ID = 150 mA

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PCB Footprints
FDY4000CZ - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT−563 CASE 419BH
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FDY4000CZ Details

  • Manufacturer Part Number:

    FDY4000CZ

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-563

  • Package Description:

    SC-89, 6 PIN

  • Manufacturer Package Code:

    419BH

  • Country Of Origin:

    South Korea

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    2 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    ESD PROTECTED

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    0.6 A

  • Drain-source On Resistance-Max:

    0.7 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    10 pF

  • JESD-30 Code:

    R-PDSO-F6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.625 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDY4000CZ Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the component away from heat sources and ensure good airflow.
  • Use a heat sink with a thermal interface material, ensure good airflow, and consider derating the device's power handling at high temperatures.
  • Handle the device by the body or pins, avoid touching the die, and use an ESD wrist strap or mat. Follow standard ESD handling procedures.
  • Yes, but ensure the device is operated within its SOA (Safe Operating Area) and follow the recommended PCB layout and thermal management guidelines.
  • Use a logic analyzer or oscilloscope to monitor signals, check for proper power supply and grounding, and consult the datasheet and application notes for guidance.

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FDY4000CZ Overview

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