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FES10D - onsemi

Description: Very Low Profile : Typical Height of 1.1mm; Very Stable Operation at Industrial Temperature, 150c; Low Forward Voltage Drop; StandardLead Free in compliance with EU RoHS 2011/65/EU Directive; Ultrafast Recovery Time ; Industrial Device Qualified per AEC-Q101 Standards* See authorized use policy; Low Thermal Resistance; RoHS CompliantGreen Mold Compound as per IEC61249

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PCB Footprints
FES10D - onsemi PCB footprint - Other - Other - TO−277−3LD CASE 340BQ ISSUE O
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3D Models
FES10D - onsemi  - 3D model - Other - TO−277−3LD CASE 340BQ ISSUE O
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FES10D Details

  • Manufacturer Part Number:

    FES10D

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-277-3

  • Manufacturer Package Code:

    340BQ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.55

  • Application:

    ULTRA FAST RECOVERY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.95 V

  • JEDEC-95 Code:

    TO-277

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    150 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.04 µs

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

FES10D Frequently Asked Questions (FAQs)

  • The FES10D can operate from -40°C to 150°C, but the maximum junction temperature (TJ) should not exceed 150°C.
  • The FES10D requires a bias voltage of 5V to 15V, and the recommended bias current is 1mA to 10mA. Ensure the bias circuit is designed to provide a stable voltage and current.
  • Use a multi-layer PCB with a solid ground plane and a thermal relief pattern under the FES10D. Ensure good thermal conductivity between the device and the heat sink or PCB.
  • Use ESD protection devices, such as TVS diodes or ESD arrays, and follow proper handling and storage procedures to prevent ESD damage.
  • The maximum power dissipation for the FES10D is 1.5W. Ensure the device is properly heat-sinked and the ambient temperature is within the recommended range.

Trust Checks

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FES10D Overview

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