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FES10G - onsemi

Description: Ultrafast Rectifiers, Surface Mount, 10 A, 400V

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PCB Footprints
FES10G - onsemi PCB footprint - Other - Other - TO−277−3LD CASE 340BQ ISSUE O_2025
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3D Models
FES10G - onsemi  - 3D model - Other - TO−277−3LD CASE 340BQ ISSUE O_2025
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FES10G Details

  • Manufacturer Part Number:

    FES10G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-277-3

  • Manufacturer Package Code:

    340BQ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.55

  • Application:

    ULTRA FAST RECOVERY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.2 V

  • JEDEC-95 Code:

    TO-277

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    150 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    10 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    400 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.04 µs

  • Reverse Test Voltage:

    400 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

FES10G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a thermal relief pattern and a solid ground plane is recommended. The thermal pad should be connected to a large copper area to dissipate heat efficiently.
  • The FES10G requires a bias voltage of 5V to 15V. Ensure the bias voltage is stable and noise-free. A decoupling capacitor of 10uF to 100uF should be placed close to the device to filter out noise.
  • The maximum allowable power dissipation of FES10G is 1.5W. Ensure the device is operated within the recommended temperature range of -40°C to 150°C to prevent overheating.
  • Yes, FES10G can be used in switching applications. However, ensure the device is operated within the recommended frequency range of 100 kHz to 1 MHz, and the switching frequency is not too high to prevent excessive power loss.
  • Handle the device by the body or use an anti-static wrist strap to prevent ESD damage. Ensure the PCB is designed with ESD protection in mind, and use ESD-sensitive handling and storage procedures.

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FES10G Overview

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