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FES1GE - Diodes Incorporated

Description: Fast switching for high efficiency • For surface mounted applications • Glass passivated chip • Low reverse leakage current • Low forward voltage drop • High current capability • Qualified according to AEC-Q101 Rev_C  Lead-Free Finish; RoHS Compliant (Notes 1 & 2)  Halogen and Antimony Free. “Green” Device (Note 3)

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FES1GE - Diodes Incorporated - PCB symbol
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PCB Footprints
FES1GE - Diodes Incorporated PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - F1A
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FES1GE - Diodes Incorporated - 3D model - Small Outline Diode Flat Lead - F1A
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FES1GE Details

  • Manufacturer Part Number:

    FES1GE

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    400 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.25 V

  • JEDEC-95 Code:

    DO-219AA

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    400 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.025 µs

  • Reverse Test Voltage:

    400 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

FES1GE Frequently Asked Questions (FAQs)

  • Diodes Incorporated recommends a compact PCB layout with short traces and minimal vias to reduce parasitic inductance and capacitance. A 4-layer PCB with a solid ground plane is recommended. Additionally, the input and output pins should be separated by a distance of at least 1mm to minimize crosstalk.
  • The FES1GE requires a bias voltage of 2.5V to 5.5V on the VCC pin. A stable bias voltage is essential for optimal performance. It is recommended to use a low-dropout linear regulator (LDO) or a switching regulator with a low output voltage ripple to ensure a stable bias voltage.
  • The FES1GE is rated for operation from -40°C to 125°C. However, the device's performance may degrade at higher temperatures, and it is recommended to derate the device's performance according to the temperature derating curve provided in the datasheet.
  • The FES1GE is a sensitive device and requires ESD protection. It is recommended to handle the device with an anti-static wrist strap or mat, and to use ESD-protected packaging and storage. Additionally, the device's pins should be connected to a ground plane or a low-impedance path to prevent ESD damage.
  • The FES1GE requires a 50Ω input and output termination to ensure optimal performance. A 50Ω resistor should be connected in series with the input and output pins to match the impedance of the device. Additionally, the input and output pins should be AC-coupled to prevent DC voltage from affecting the device's performance.

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FES1GE Overview

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