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FFB5551 - onsemi

Description: E1 is Pin 1.; This device is deisgned for general purpose high voltage amplifiers.

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PCB Footprints
FFB5551 - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - 6-LEAD ,SC70 EIAJ SC88,1.25MM WIDE
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3D Models
FFB5551 - onsemi  - 3D model - SOT23 (6-Pin) - 6-LEAD ,SC70 EIAJ SC88,1.25MM WIDE
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FFB5551 Details

  • Manufacturer Part Number:

    FFB5551

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-88-6 / SC-70-6 / SOT-363-6

  • Manufacturer Package Code:

    419AD

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Collector Current-Max (IC):

    0.2 A

  • Collector-Emitter Voltage-Max:

    160 V

  • Configuration:

    SEPARATE, 2 ELEMENTS

  • DC Current Gain-Min (hFE):

    30

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.2 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    100 MHz

FFB5551 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The maximum allowed voltage on the enable pin (EN) is 6V. Exceeding this voltage may damage the device.
  • Yes, but ensure the device is properly bypassed and decoupled. Also, consider the device's switching frequency limitations and potential EMI issues.
  • Use a soft-start circuit or a current limiter to control the inrush current. This will prevent excessive current draw and potential damage to the device.

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FFB5551 Overview

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