The recommended land pattern for FFLI6B1607K is a rectangular pad with a size of 1.6mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
Yes, FFLI6B1607K is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the component's performance and reliability may degrade at temperatures above 125°C, so careful consideration should be given to the specific application requirements.
To prevent damage during assembly, handle the FFLI6B1607K by the edges or the body, avoiding touching the terminations or the component's electrical contacts. Use anti-static wrist straps, mats, or other ESD protection devices to prevent electrostatic discharge damage.
FFLI6B1607K is not hermetically sealed, so it is not recommended for use in humid or moist environments. If the component is exposed to moisture, it may lead to corrosion or electrical failures. If operation in a humid environment is required, consider using a conformal coating or other environmental protection measures.
The recommended soldering profile for FFLI6B1607K is a peak temperature of 260°C, with a dwell time of 10-30 seconds. The component should be soldered using a solder with a melting point of 217°C or higher.
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FFLI6B1607K-- Overview
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About Kyocera AVX
Kyocera AVX is a global leader in the design, manufacture, and supply of electronic components, including capacitors, resistors, filters, connectors, and advanced ceramic products. The company was formed as a result of Kyocera Corporation's acquisition of AVX Corporation, combining Kyocera's expertise in ceramic technologies with AVX's strength in passive electronic components. This merger has allowed Kyocera AVX to offer a broad and diversified product portfolio, serving various industries.
