FFSB0665B-F085 footprint, schematic symbol and 3D model by onsemi

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PCB Footprints

FFSB0665B-F085 - onsemi PCB footprint - Other - Other - D2PAK2 (TO−263−2L)_2023

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Datasheet Download Datasheet
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Part Number FFSB0665B-F085
Manufacturer onsemi
Pin Count 3
Part Category Schottky Diode
Package Category Other
Footprint Name Other - D2PAK2 (TO−263−2L)_2023
Released Date May 2, 2023
Last Modified Date Jan 22, 2025 4:53 PM UTC
Pinout / Pin List Click Here (Member Only)

FFSB0665B-F085 Details

Manufacturer Part Number:
FFSB0665B-F085
Brand Name:
onsemi
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
D2PAK2 (TO-263-2L)
Package Description:
TO-263, D2PAK-3/2
Manufacturer Package Code:
418BK
Country Of Origin:
Mainland China
ECCN Code:
EAR99
HTS Code:
8541.10.00.80
Manufacturer:
onsemi
YTEOL:
6
Additional Feature:
HIGH RELIABILITY, PD-CASE
Application:
EFFICIENCY
Case Connection:
CATHODE
Configuration:
SINGLE
Diode Element Material:
SILICON CARBIDE
Diode Type:
RECTIFIER DIODE
Forward Voltage-Max (VF):
1.7 V
JEDEC-95 Code:
TO-263AB
JESD-30 Code:
R-PSSO-G2
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Non-rep Pk Forward Current-Max:
45 A
Number of Elements:
1
Number of Phases:
1
Number of Terminals:
2
Operating Temperature-Max:
175 °C
Operating Temperature-Min:
-55 °C
Output Current-Max:
8 A
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Power Dissipation-Max:
61 W
Reference Standard:
AEC-Q101
Rep Pk Reverse Voltage-Max:
650 V
Reverse Current-Max:
40 µA
Reverse Test Voltage:
650 V
Surface Mount:
YES
Technology:
SCHOTTKY
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
30

FFSB0665B-F085 Frequently Asked Questions (FAQs)

A recommended PCB layout for optimal thermal performance would be to use a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and to place thermal vias under the device to dissipate heat efficiently.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, use a suitable thermal interface material, and provide adequate airflow around the device. Additionally, consider using a heat sink or a thermal management system to keep the device within a safe operating temperature range.
Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, decreased performance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
The FFSB0665B-F085 is an industrial-grade device, but it may not meet the specific requirements for high-reliability or automotive applications. It's essential to review the device's specifications and certifications (e.g., AEC-Q101) to ensure it meets the necessary standards for your application.
To prevent electrostatic discharge (ESD) damage, follow proper ESD handling and assembly procedures, such as using ESD-safe workstations, wrist straps, and packaging materials. Ensure that all personnel handling the device are properly grounded, and consider using ESD protection devices or circuits in the design.

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FFSB0665B-F085 Overview

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