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FFSB3065B - onsemi

Description: No Reverse Recovery / No Forward Recovery; Low Vf @ TJ:175 °C; Max Junction Temperature 175 °C; Avalanche Rated 144 mJ; High Surge Current Capacity; Positive Temperature Coefficient

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PCB Footprints
FFSB3065B - onsemi PCB footprint - Other - Other - FFSB3065B-1
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3D Models
FFSB3065B - onsemi  - 3D model - Other - FFSB3065B-1
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FFSB3065B Details

  • Manufacturer Part Number:

    FFSB3065B

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    D2PAK2 (TO-263-2L)

  • Manufacturer Package Code:

    418BK

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.89

  • Additional Feature:

    HIGH RELIABILITY, PD-CASE

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.7 V

  • JEDEC-95 Code:

    TO-263AB

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    120 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    73 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    246 W

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    40 µA

  • Reverse Test Voltage:

    650 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

FFSB3065B Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Also, consider derating the device's power handling at high temperatures.
  • The maximum allowable voltage stress is 1.5 times the maximum rated voltage (Vds) for a short duration (<1ms). Exceeding this may cause permanent damage to the device.
  • Use a transient voltage suppressor (TVS) or a zener diode to clamp voltage transients. Ensure the device is operated within the recommended voltage and current ratings.
  • A gate drive voltage of 10-15V and a current of 1-2A is recommended for optimal switching performance. However, the exact values may vary depending on the specific application and PCB layout.

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FFSB3065B Overview

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