Description:Max Junction Temperature 175 °C; Avalanche Rated 100 mJ; High Surge Current Capacity; Positive Temperature Coefficient; No Reverse Recovery / No Forward Recovery
The recommended PCB layout for optimal thermal performance involves using a thermal pad on the bottom of the package, connecting it to a large copper area on the PCB, and using multiple vias to dissipate heat to the other layers. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and avoid exceeding the maximum junction temperature (Tj) of 150°C. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
The FFSH10120A-F155 has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures when handling the device. A human body model (HBM) of 2kV and a machine model (MM) of 200V are recommended for ESD protection.
Yes, the FFSH10120A-F155 is suitable for high-reliability and automotive applications. It's AEC-Q101 qualified and meets the requirements for automotive-grade reliability. However, it's essential to follow the recommended operating conditions and ensure that the device is used within its specified ratings.
To troubleshoot issues with the device, start by reviewing the application circuit and ensuring that it meets the recommended operating conditions. Check for proper heat sinking, adequate power supply, and correct component selection. Use oscilloscopes and thermal imaging tools to identify potential issues. Consult the datasheet and application notes for guidance, and contact onsemi support if necessary.
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FFSH10120A-F155 Overview
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