Description:Max Junction Temperature 175 °C; Avalanche Rated 80 mJ; High Surge Current Capacity; Positive Temperature Coefficient; No Reverse Recovery / No Forward Recovery
The recommended PCB layout for optimal thermal performance involves using a thermal pad on the bottom of the device, connecting it to a large copper area on the PCB, and using multiple vias to dissipate heat. A minimum of 2oz copper thickness is recommended.
To ensure proper biasing, follow the recommended biasing circuit in the datasheet, and make sure the input voltage is within the specified range (typically 12V to 15V). Also, ensure the input voltage is well-regulated and filtered to minimize noise and ripple.
The maximum allowed case temperature for the FFSH15120ADN-F155 is 150°C. However, it's recommended to keep the case temperature below 125°C for optimal reliability and performance.
The FFSH15120ADN-F155 is not hermetically sealed, so it's not recommended for use in high-humidity environments. If you must use it in such an environment, ensure proper conformal coating and follow the manufacturer's guidelines for moisture protection.
The recommended storage condition for the FFSH15120ADN-F155 is in a dry, cool place with a temperature range of -40°C to 30°C and relative humidity below 60%. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.
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FFSH15120ADN-F155 Overview
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