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FFSH1665ADN-F155 - onsemi

Description: DIODE ARRAY SIC 650V TO247-3

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FFSH1665ADN-F155 - onsemi  - 3D model
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FFSH1665ADN-F155 Details

  • Manufacturer Part Number:

    FFSH1665ADN-F155

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-247-3

  • Manufacturer Package Code:

    340CH

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    6 Weeks

  • Date Of Intro:

    2018-02-01

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    HIGH RELIABILITY, PD-CASE

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.75 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    730 A

  • Number of Elements:

    2

  • Number of Phases:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    11 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Power Dissipation-Max:

    77 W

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    200 µA

  • Reverse Test Voltage:

    650 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

FFSH1665ADN-F155 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a 2-layer or 4-layer board with a solid ground plane on the bottom layer, and to place thermal vias under the device to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, use a suitable thermal interface material, and ensure good airflow around the device. Additionally, consider using a heat sink or a thermal management system to keep the device within its operating temperature range.
  • The FFSH1665ADN-F155 has built-in ESD protection, but it's still important to follow standard ESD handling precautions when handling the device, such as using an ESD wrist strap, ESD mat, and ESD-safe packaging materials.
  • Yes, the FFSH1665ADN-F155 is suitable for high-reliability and automotive applications. However, it's essential to follow the recommended operating conditions, and to ensure that the device is properly qualified and validated for the specific application.
  • The recommended soldering and assembly techniques for the FFSH1665ADN-F155 include using a soldering iron with a temperature range of 250°C to 260°C, and following the recommended soldering profile. It's also important to use a suitable solder paste and to ensure that the device is properly cleaned and dried before assembly.

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FFSH1665ADN-F155 Overview

Use the download button to access the FFSH1665ADN-F155 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like FFSH1, or try a keyword search, such as Rectifier Diodes

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