Description:Max Junction Temperature 175 °C; Avalanche Rated 200 mJ; High Surge Current Capacity; Positive Temperature Coefficient; No Reverse Recovery / No Forward Recovery
A good PCB layout should ensure minimal thermal resistance, use a solid ground plane, and keep the device away from heat sources. A thermal pad or heat sink can be used to dissipate heat. Consult onsemi's application notes and thermal management guidelines for more information.
Follow onsemi's recommended operating conditions, use a suitable heat sink or thermal management system, and ensure good airflow. Consider using a thermistor or temperature sensor to monitor the device temperature and implement thermal protection if necessary.
Handle the device with ESD-protective equipment, follow proper handling and storage procedures, and use ESD-protective packaging. The device has built-in ESD protection, but it's not a substitute for proper handling and precautions.
Yes, the FFSH20120A-F155 is AEC-Q101 qualified and suitable for automotive and high-reliability applications. However, ensure you follow onsemi's guidelines and recommendations for these applications, and consult with their technical support team if necessary.
Follow onsemi's recommended soldering and assembly guidelines, use a suitable soldering iron and flux, and ensure the device is properly aligned and secured during assembly. Consult onsemi's application notes and assembly guidelines for more information.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
FFSH20120A-F155 Overview
Use the download button to access the FFSH20120A-F155 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like FFSH2,
or try a keyword search, such as Rectifier Diodes
