Description:Max Junction Temperature 175 °C; High Surge Current Capacity; Positive Temperature Coefficient; No Reverse Recovery / No Forward Recovery; Pb−Free, Halogen Free/BFR Free and RoHS Compliant
The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the package, using a minimum of 2oz copper thickness, and ensuring good thermal conduction to the surrounding PCB area. A thermal via array can also be used to improve heat dissipation.
To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including junction temperature (Tj) and ambient temperature (Ta). Additionally, consider using a heat sink, thermal interface material, and ensuring good airflow around the device.
The FFSH2065A has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is handled in a static-safe environment.
The FFSH2065A is not hermetically sealed, so it's not recommended for use in high-humidity environments. If operation in humid environments is required, consider using a conformal coating or potting the device to prevent moisture ingress.
The recommended soldering conditions for the FFSH2065A include a peak temperature of 260°C, a soldering time of 10 seconds or less, and using a solder with a melting point above 217°C. Follow the recommended soldering profile to prevent damage to the device.
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FFSH2065A Overview
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