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FFSH2065B-F085 - onsemi

Description: Max Junction Temperature 175C; Avalanche Rated 94 mJ; High Surge Current Capacity; Positive Temperature Coefficient; Ease of Paralleling; No Reverse Recovery / No Forward Recovery; AEC-Q101 Qualified and PPAP Capable

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PCB Footprints
FFSH2065B-F085 - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO−247−2LD CASE 340DA ISSUE A
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3D Models
FFSH2065B-F085 - onsemi  - 3D model - Transistor Outline, Vertical - TO−247−2LD CASE 340DA ISSUE A
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FFSH2065B-F085 Details

  • Manufacturer Part Number:

    FFSH2065B-F085

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-247-2LD

  • Manufacturer Package Code:

    340DA

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    HIGH RELIABILITY, PD-CASE

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.7 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T2

  • JESD-609 Code:

    e3

  • Non-rep Pk Forward Current-Max:

    84 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    22.3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Power Dissipation-Max:

    148 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    40 µA

  • Reverse Test Voltage:

    650 V

  • Surface Mount:

    NO

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

FFSH2065B-F085 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The SOA is not explicitly stated in the datasheet. However, it can be estimated by considering the device's voltage, current, and power ratings. Consult with onsemi's application engineers for specific guidance.
  • Yes, the FFSH2065B-F085 is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, additional testing and validation may be required for specific use cases.
  • Follow proper ESD handling procedures during assembly and storage. The device has built-in ESD protection, but it's still important to take precautions to prevent damage.

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FFSH2065B-F085 Overview

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