Description:Max Junction Temperature 175°C; High Surge Current Capacity; Positive Temperature Coefficient; No Reverse Recovery / No Forward Recovery; Pb−Free, Halogen Free/BFR Free and RoHS Compliant
The recommended PCB layout for optimal thermal performance involves using a thermal pad on the bottom of the package, connecting it to a large copper area on the PCB, and using thermal vias to dissipate heat to the other side of the board. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, use a suitable heat sink, and ensure good airflow around the device. Additionally, the device should be operated within the specified junction temperature range (TJ) of -40°C to 150°C.
The maximum allowed voltage on the input pins is 30V, which is the absolute maximum rating. However, for reliable operation, it's recommended to keep the input voltage within the specified range of 12V to 24V.
The FFSH5065A-F155 is not hermetically sealed, so it's not recommended for use in high-humidity environments. If operation in high humidity is required, consider using a conformal coating or potting the device to protect it from moisture.
The FFSH5065A-F155 has an ESD rating of 2kV human body model (HBM) and 200V machine model (MM). To ensure reliable operation, it's recommended to follow proper ESD handling procedures and use ESD protection devices such as TVS diodes or ESD suppressors on the input lines.
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FFSH5065A-F155 Overview
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