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FFSM1265A - onsemi

Description: Max Junction Temperature 175 °C; Leadless Ultra-thin SMD package; High Surge Current Capacity; Positive Temperature Coefficient; No Reverse Recovery / No Forward Recovery; Pb−Free, Halogen Free/BFR Free and RoHS Compliant

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PCB Footprints
FFSM1265A - onsemi PCB footprint - Other - Other - PQFN4 8X8, 2P CASE 483AP ISSUE O
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3D Models
FFSM1265A - onsemi  - 3D model - Other - PQFN4 8X8, 2P CASE 483AP ISSUE O
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FFSM1265A Details

  • Manufacturer Part Number:

    FFSM1265A

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PQFN-4

  • Package Description:

    PQFN-5

  • Manufacturer Package Code:

    483AP

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    6.62

  • Additional Feature:

    HIGH RELIABILITY, PD-CASE

  • Application:

    EFFICIENCY

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON CARBIDE

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.75 V

  • JESD-30 Code:

    S-PSSO-N4

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    63 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    12.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    80 W

  • Rep Pk Reverse Voltage-Max:

    650 V

  • Reverse Current-Max:

    200 µA

  • Reverse Test Voltage:

    650 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

FFSM1265A Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermal interface material to improve heat transfer.
  • The maximum allowed voltage on the VIN pin is 28V, but it's recommended to keep it below 24V for reliable operation.
  • Yes, the FFSM1265A is suitable for high-frequency switching applications up to 1MHz. However, ensure proper PCB layout and decoupling to minimize EMI and noise.
  • Use a fuse or a current limiter to protect against overcurrent. For overvoltage protection, use a voltage regulator or a TVS diode to clamp the input voltage.

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FFSM1265A Overview

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