Description:Avalanche Rated 94 mJ; Max Junction Temperature 175 °C; High Surge Current Capacity; Positive Temperature Coefficient; No Reverse Recovery/No Forward Recovery; Low Vf @ TJ:175 °C
The recommended PCB layout for optimal thermal performance involves placing the device on a thermal pad connected to a large copper area on the PCB, and using multiple vias to dissipate heat to the bottom layer. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation at high temperatures, it is essential to follow the recommended thermal design guidelines, use a suitable heat sink, and ensure good airflow around the device. Additionally, the device should be operated within the specified junction temperature range (TJ) of -55°C to 150°C.
The maximum allowable voltage on the gate pin is ±20V, but it is recommended to limit the voltage to ±15V to ensure reliable operation and prevent damage to the device.
To protect the device from ESD, it is recommended to handle the device by the body, use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment. Additionally, the device should be soldered using an ESD-safe soldering iron and process.
The recommended gate drive voltage for optimal switching performance is 10V to 15V, but it can be adjusted based on the specific application requirements and the desired trade-off between switching speed and power loss.
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FFSP2065B Overview
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