Description:Low Vf @ TJ:175 °C; Max Junction Temperature 175 °C; Avalanche Rated 144 mJ; High Surge Current Capacity; Positive Temperature Coefficient; No Reverse Recovery / No Forward Recovery
The recommended PCB layout for optimal thermal performance involves using a thermal pad on the bottom of the package, connecting it to a large copper area on the PCB, and using multiple vias to dissipate heat. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation at high temperatures, it's essential to follow the recommended thermal design guidelines, use a suitable heat sink, and ensure good airflow around the device. Additionally, derating the device's power dissipation and voltage ratings can help prevent overheating.
The FFSP3065B has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures when handling the device. A human body model (HBM) of 2kV and a machine model (MM) of 200V are recommended for ESD protection.
The FFSP3065B is not hermetically sealed, so it's not recommended for use in high-humidity environments. However, if it's necessary to use the device in such an environment, it's essential to follow proper moisture-sensitive device handling procedures and use a conformal coating to protect the device.
The recommended storage temperature range for the FFSP3065B is -40°C to 125°C, and the recommended storage humidity range is 20% to 80% relative humidity.
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FFSP3065B Overview
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