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FGAF40N60SMD - onsemi

Description: IGBT Field Stop 600 V 80 A 115 W Through Hole TO-3PF

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PCB Footprints
FGAF40N60SMD - onsemi PCB footprint - Other - Other - TO−3PF−3L CASE 340AH ISSUE A
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3D Models
FGAF40N60SMD - onsemi  - 3D model - Other - TO−3PF−3L CASE 340AH ISSUE A
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FGAF40N60SMD Details

  • Manufacturer Part Number:

    FGAF40N60SMD

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-3PF-3L

  • Package Description:

    SC-94, TO-3PF, 3 PIN

  • Manufacturer Package Code:

    340AH

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    5.25

  • Case Connection:

    ISOLATED

  • Collector Current-Max (IC):

    80 A

  • Collector-Emitter Voltage-Max:

    600 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Fall Time-Max (tf):

    17 ns

  • Gate-Emitter Thr Voltage-Max:

    6 V

  • Gate-Emitter Voltage-Max:

    20 V

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    115 W

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    MOTOR CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    132 ns

  • Turn-on Time-Nom (ton):

    37 ns

FGAF40N60SMD Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the FGAF40N60SMD is -55°C to 150°C.
  • To ensure proper cooling, a heat sink with a thermal resistance of less than 10°C/W is recommended. Additionally, the device should be mounted on a PCB with a thermal via to dissipate heat efficiently.
  • The recommended gate drive voltage for the FGAF40N60SMD is between 10V and 15V, with a maximum gate-source voltage of 20V.
  • To protect the FGAF40N60SMD from overvoltage and overcurrent, a voltage clamp or a transient voltage suppressor (TVS) can be used. Additionally, a current sense resistor and a fuse can be used to detect and respond to overcurrent conditions.
  • The maximum allowable power dissipation for the FGAF40N60SMD is 150W, assuming a maximum junction temperature of 150°C.

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FGAF40N60SMD Overview

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