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FGBS3040E1-F085 - onsemi

Description: Last Shipments - IGBT, EcoSPARK 3 270mJ, 360V, N-Channel Ignition

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FGBS3040E1-F085 - onsemi PCB footprint - Other - Other - FGBS3040E1-F085-2
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FGBS3040E1-F085 Details

  • Manufacturer Part Number:

    FGBS3040E1-F085

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-263 7L (D2PAK)

  • Package Description:

    HSOP, SMSIP6/7H,.6,50TB

  • Manufacturer Package Code:

    418AY

  • Reach Compliance Code:

    Not Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    R-PSSO-G6

  • Length:

    9.95 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Output Current Flow Direction:

    SOURCE

  • Output Current-Max:

    19 A

  • Output Peak Current Limit-Nom:

    19 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SMSIP6/7H,.6,50TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    245

  • Seated Height-Max:

    4.7 mm

  • Supply Current-Max:

    5 mA

  • Supply Voltage-Max:

    28 V

  • Supply Voltage-Min:

    5 V

  • Supply Voltage1-Max:

    28 V

  • Supply Voltage1-Min:

    4 V

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    28 µs

  • Turn-on Time:

    26 µs

  • Width:

    9.2 mm

FGBS3040E1-F085 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The SOA is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal resistance, maximum junction temperature, and power handling. Consult with onsemi's application engineers for guidance.
  • Yes, the FGBS3040E1-F085 is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, additional testing and validation may be required for specific use cases.
  • Follow proper ESD handling procedures during assembly and storage. The device has built-in ESD protection, but it's still important to handle the device by the body or use an ESD wrist strap to prevent damage.

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FGBS3040E1-F085 Overview

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