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FGL40N120AND - onsemi

Description: IGBT NPT 1200 V 64 A 500 W Through Hole TO-264-3

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FGL40N120AND - onsemi  - 3D model
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FGL40N120AND Details

  • Manufacturer Part Number:

    FGL40N120AND

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Additional Feature:

    LOW CONDUCTION LOSS

  • Collector Current-Max (IC):

    64 A

  • Collector-Emitter Voltage-Max:

    1200 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Fall Time-Max (tf):

    80 ns

  • Gate-Emitter Thr Voltage-Max:

    7.5 V

  • Gate-Emitter Voltage-Max:

    25 V

  • JEDEC-95 Code:

    TO-264

  • JESD-30 Code:

    R-PSFM-T3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    500 W

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    MOTOR CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    165 ns

  • Turn-on Time-Nom (ton):

    45 ns

  • VCEsat-Max:

    3.2 V

FGL40N120AND Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) for the FGL40N120AND is typically defined by the manufacturer as the maximum voltage and current ratings that the device can handle without damage. However, it's essential to note that the SOA can vary depending on the specific application, operating conditions, and thermal management. It's recommended to consult with onsemi's application engineers or refer to their technical documentation for more information.
  • Proper thermal management is crucial for the FGL40N120AND to ensure reliable operation and prevent overheating. This can be achieved by using a suitable heat sink, ensuring good thermal interface material (TIM) between the device and heat sink, and providing adequate airflow. The recommended junction-to-case thermal resistance (RθJC) for the FGL40N120AND is typically around 0.5°C/W. It's essential to follow onsemi's thermal management guidelines and consult with their application engineers for specific recommendations.
  • The recommended gate drive voltage for the FGL40N120AND is typically between 10V to 15V, with a maximum rating of 20V. However, the optimal gate drive voltage may vary depending on the specific application, switching frequency, and desired performance. It's recommended to consult with onsemi's application engineers or refer to their technical documentation for more information.
  • Yes, the FGL40N120AND can be used in a parallel configuration to increase the overall current handling capability. However, it's essential to ensure that the devices are properly matched, and the gate drive signals are synchronized to prevent uneven current sharing. Additionally, the thermal management and PCB design should be carefully considered to ensure reliable operation. It's recommended to consult with onsemi's application engineers for specific guidance on parallel configuration.
  • The typical switching frequency range for the FGL40N120AND is up to 100 kHz, although it can operate at higher frequencies depending on the specific application and design. However, as the switching frequency increases, the device's losses and thermal management requirements also increase. It's recommended to consult with onsemi's application engineers for specific guidance on switching frequency and design considerations.

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FGL40N120AND Overview

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