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FGP20N60UFDTU - onsemi

Description: Last Shipments - IGBT, 400V, 26A, 1.35V, 300mJ, TO-220EcoSPARK II, N-Channel Ignition

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PCB Footprints
FGP20N60UFDTU - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB_2022
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3D Models
FGP20N60UFDTU - onsemi  - 3D model - Transistor Outline, Vertical - TO-220AB_2022
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FGP20N60UFDTU Details

  • Manufacturer Part Number:

    FGP20N60UFDTU

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220-3

  • Package Description:

    ROHS COMPLIANT PACKAGE-3

  • Manufacturer Package Code:

    340AT

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Collector Current-Max (IC):

    40 A

  • Collector-Emitter Voltage-Max:

    600 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Fall Time-Max (tf):

    64 ns

  • Gate-Emitter Thr Voltage-Max:

    6.5 V

  • Gate-Emitter Voltage-Max:

    20 V

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    165 W

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    155 ns

  • Turn-on Time-Nom (ton):

    29 ns

FGP20N60UFDTU Frequently Asked Questions (FAQs)

  • The maximum junction temperature that the FGP20N60UFDTU can withstand is 150°C.
  • To ensure proper cooling, a heat sink with a thermal resistance of less than 1°C/W is recommended. Additionally, ensure good airflow around the device and avoid blocking the heat sink fins.
  • The recommended gate resistor value for the FGP20N60UFDTU is between 10Ω to 100Ω, depending on the specific application and switching frequency.
  • Yes, the FGP20N60UFDTU is suitable for high-reliability applications. It is manufactured using a robust process and has undergone rigorous testing to ensure its reliability.
  • To protect the FGP20N60UFDTU from ESD, handle the device by the body or use an ESD wrist strap or mat. Ensure that the device is stored in an ESD-safe environment and that all equipment used to handle the device is ESD-safe.

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FGP20N60UFDTU Overview

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