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FIN1028MX - onsemi

Description: Buffers & Line Drivers 3.3V LVDS Receiver 2Bit HS Differential

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PCB Footprints
FIN1028MX - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - 8-Lead, Small Outline Package (SOIC), JEDEC MS-012, 0.150-inch, Narrow Body
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3D Models
FIN1028MX - onsemi  - 3D model - Small Outline Packages - 8-Lead, Small Outline Package (SOIC), JEDEC MS-012, 0.150-inch, Narrow Body
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for FIN1028MX
  • Part Number FIN1028MX
  • Manufacturer onsemi
  • Pin Count 8
  • Part Category Integrated Circuit
  • Package Category Small Outline Packages
  • Footprint Name Small Outline Packages - 8-Lead, Small Outline Package (SOIC), JEDEC MS-012, 0.150-inch, Narrow Body
  • Released Date Aug 7, 2025
  • Last Modified Date Aug 7, 2025 8:36 AM UTC
  • Pinout / Pin List Click Here (Member Only)

FIN1028MX Details

  • Manufacturer Part Number:

    FIN1028MX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOIC-8

  • Manufacturer Package Code:

    751EB

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7.1

  • Input Characteristics:

    DIFFERENTIAL

  • Interface IC Type:

    LINE RECEIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.902 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Low Current-Max:

    0.008 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    2.5 ns

  • Receiver Number of Bits:

    2

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    9 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

FIN1028MX Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power handling at high temperatures.
  • The maximum allowed voltage on the enable pin (EN) is 6V. Exceeding this voltage may damage the device.
  • Yes, but ensure that the switching frequency is within the recommended range (up to 1 MHz). Also, consider the device's power losses and thermal performance at high frequencies.
  • Use external overcurrent protection (OCP) and overvoltage protection (OVP) circuits. The FIN1028MX has built-in thermal shutdown, but it's not a substitute for external protection circuits.

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FIN1028MX Overview

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