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FIN1047MX - onsemi

Description: Greater than 400Mbs data rate; 16-Lead SOIC and TSSOP packages save space; 3.3V power supply operation; Meets or exceeds the TIA/EIA-644 LVDS standard; Pin compatible with equivalent RS-422 and LVPECL devices; 1.7 ns maximum propagation delay; 0.4 ns maximum differential pulse skew; Power-Off protection; Low power dissipation; Flow-through pinout simplifies PCB layout

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PCB Footprints
FIN1047MX - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - M16A_2023
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FIN1047MX - onsemi  - 3D model - Small Outline Packages - M16A_2023
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FIN1047MX Details

  • Manufacturer Part Number:

    FIN1047MX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    SOIC-16

  • Package Description:

    0.150 INCH, MS-012, SOIC-16

  • Manufacturer Package Code:

    751BG

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    3

  • Differential Output:

    YES

  • Driver Number of Bits:

    4

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE DRIVER

  • Interface Standard:

    EIA-644; TIA-644

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    0.25 V

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    1.7 ns

  • Width:

    3.9 mm

FIN1047MX Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power dissipation at high temperatures.
  • The maximum allowed voltage on the EN pin is 6V. Exceeding this voltage may damage the device.
  • Yes, but ensure the device is properly heat-sunk and the current is within the recommended operating range. Also, consider the device's power dissipation and thermal limitations.
  • Check the input voltage, output voltage, and feedback resistors. Ensure the feedback network is properly connected and the output voltage is within the recommended range.

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FIN1047MX Overview

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Part Image FIN1047M Fairchild Semiconductor Corporation

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Part Image DS90LV047ATMX Texas Instruments

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Part Image FIN1047MX_NL Fairchild Semiconductor Corporation

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For a full list of alternate parts for FIN1047MX, check out Findchips.com