FJB5555TM footprint, schematic symbol and 3D model by onsemi

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PCB Footprints

FJB5555TM - onsemi PCB footprint - Other - Other - D2PAK−3 (TO−263, 3−LEAD) CASE 418AJ ISSUE F_2025-1.2

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Stock & Prices Price & Stock for FJB5555TM
Part Number FJB5555TM
Manufacturer onsemi
Pin Count 3
Part Category Transistor BJT NPN
Package Category Other
Footprint Name Other - D2PAK−3 (TO−263, 3−LEAD) CASE 418AJ ISSUE F_2025-1.2
Released Date Dec 9, 2025
Last Modified Date Dec 9, 2025 4:37 PM UTC
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FJB5555TM Details

Manufacturer Part Number:
FJB5555TM
Brand Name:
onsemi
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
Part Package Code:
D2PAK-3 / TO-263-2
Package Description:
TO-263, D2PAK-3/2
Manufacturer Package Code:
418AJ
Country Of Origin:
Mainland China
ECCN Code:
EAR99
Factory Lead Time:
18 Weeks
Manufacturer:
onsemi
YTEOL:
4
Collector Current-Max (IC):
5 A
Collector-Emitter Voltage-Max:
400 V
Configuration:
SINGLE
DC Current Gain-Min (hFE):
20
JEDEC-95 Code:
TO-263AB
JESD-30 Code:
R-PSSO-G2
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
2
Operating Temperature-Max:
150 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
NPN
Power Dissipation-Max (Abs):
100 W
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn) - annealed
Terminal Form:
GULL WING
Terminal Position:
SINGLE
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON

FJB5555TM Frequently Asked Questions (FAQs)

A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
Implement a proper heat sink design, ensure good airflow, and consider using a thermal interface material (TIM) to reduce thermal resistance. Monitor junction temperature (Tj) and adjust the design accordingly.
Use a shielded enclosure, keep high-frequency traces short, and use a common-mode choke or ferrite bead to filter out noise. Ensure proper grounding and decoupling to minimize radiation.
Use a low-dropout linear regulator or a switching regulator with a low quiescent current. Optimize the circuit design for low voltage and current, and consider using a power gating technique.
Use a 4-wire Kelvin connection for accurate voltage and current measurements. Ensure proper probe placement and consider using a high-impedance probe to minimize loading effects.

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