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FJPF13007H2TU - onsemi

Description: High Speed Switching; High Voltage Capability; Suitable for Switching Regulator and Motor Control

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PCB Footprints
FJPF13007H2TU - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220F-ren1
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3D Models
FJPF13007H2TU - onsemi  - 3D model - Transistor Outline, Vertical - TO-220F-ren1
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FJPF13007H2TU Details

  • Manufacturer Part Number:

    FJPF13007H2TU

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220-3 FullPak

  • Package Description:

    TO-220F, 3 PIN

  • Manufacturer Package Code:

    221AT

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Case Connection:

    ISOLATED

  • Collector Current-Max (IC):

    8 A

  • Collector-Emitter Voltage-Max:

    400 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    26

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    40 W

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    4 MHz

FJPF13007H2TU Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
  • Use a reflow soldering process with a peak temperature of 240°C to 250°C. Avoid wave soldering and minimize exposure to moisture.
  • Implement EOS protection circuits, such as TVS diodes or zener diodes, and ensure proper PCB layout and routing to minimize parasitic inductance.
  • Store the device in a dry, cool place, away from direct sunlight. Handle the device by the body, avoiding touching the pins or die. Use anti-static packaging and follow ESD precautions.

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FJPF13007H2TU Overview

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