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FL7701MX - onsemi

Description: Soft-Start Function; Low Operating Current: 0.85mA (Typical); Digitally Implemented Active PFC Function (No Additional Circuit Necessary for High PF); Retrofit E11/E14/E17/E26/E27, MR, and PAR Lamps; Precise Internal Reference: ±3%; Cycle-by-Cycle Current Limit; Programmable LED Current; Built-in Over-Temperature Protection Function; AOCP Function with Auto-Restart Mode; Under-Voltage Lockout with 5V Hysteresis; Ornament, Interior Light, and Panel Lighting ; Analog Dimming Function; Programmable Oscillation

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PCB Footprints
FL7701MX - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - 8-LEAD, SOIC, JDEC-MS-012, 0.150" NARROW BODY
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3D Models
FL7701MX - onsemi  - 3D model - Small Outline Packages - 8-LEAD, SOIC, JDEC-MS-012, 0.150" NARROW BODY
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FL7701MX Details

  • Manufacturer Part Number:

    FL7701MX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Manufacturer Package Code:

    751EB

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    7.89

  • Data Input Mode:

    SERIAL

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LED DISPLAY DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Multiplexed Display Capability:

    NO

  • Number of Functions:

    1

  • Number of Segments:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Characteristics:

    CONSTANT-CURRENT

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    1.1 mA

  • Supply Voltage-Max:

    17 V

  • Supply Voltage-Min:

    14 V

  • Supply Voltage-Nom:

    15.5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

  • fmax-Min:

    0.3 MHz

FL7701MX Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system design accordingly.
  • Use X7R or X5R ceramic capacitors with a voltage rating of 10V or higher. For input capacitors, use 10uF to 22uF capacitors. For output capacitors, use 10uF to 47uF capacitors.
  • Use the EN pin to disable the device when not in use. Ensure the input voltage is within the recommended range, and use a low-quiescent-current LDO regulator for the VCC pin.
  • Keep the inductor and capacitors close to the FL7701MX. Use a symmetrical layout and ensure the inductor's magnetic field is perpendicular to the PCB. Use a shielded inductor or a common-mode choke to reduce EMI.

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FL7701MX Overview

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