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FLS6617MX - onsemi

Description: Obsolete - NPN Multi-Chip General Purpose Amplifier

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PCB Footprints
FLS6617MX - onsemi PCB footprint - Other - Other - FLS6617MX-2
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3D Models
FLS6617MX - onsemi  - 3D model - Other - FLS6617MX-2
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FLS6617MX Details

  • Manufacturer Part Number:

    FLS6617MX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-7

  • Package Description:

    SOP-8/7

  • Manufacturer Package Code:

    751ED

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    2017-10-10

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    23 V

  • Input Voltage-Min:

    5.5 V

  • Input Voltage-Nom:

    15 V

  • JESD-30 Code:

    R-PDSO-G7

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    7

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.75 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    SINGLE

  • Switching Frequency-Max:

    56 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

FLS6617MX Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Monitor the device's junction temperature (TJ) and adjust the design accordingly.
  • The maximum allowed voltage on the VIN pin is 28V, but it's recommended to keep it below 24V for optimal reliability and performance.
  • Yes, the FLS6617MX is designed for high-reliability applications. However, it's essential to follow proper design and layout guidelines, and implement adequate fault detection and correction mechanisms.
  • Use a logic analyzer or oscilloscope to monitor the device's signals. Check the datasheet for troubleshooting guidelines, and consult onsemi's application notes and technical support resources if needed.

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FLS6617MX Overview

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