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FM16W08-SG - Infineon

Description: Cypress Semiconductor FM16W08-SG Parallel FRAM Memory, 64kbit, 70ns, 2.7 → 5.5 V SOIC 28-Pin

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PCB Footprints
FM16W08-SG - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 28-Pin SOIC-ren1
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3D Models
FM16W08-SG - Infineon  - 3D model - Small Outline Packages - 28-Pin SOIC-ren1
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FM16W08-SG Details

  • Manufacturer Part Number:

    FM16W08-SG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Thailand

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    4.9

  • Access Time-Max:

    80 ns

  • Additional Feature:

    DATA RETENTION TIME @ 85 DEGREE CENTIGRADE

  • Data Retention Time-Min:

    10

  • Endurance:

    100000000000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    17.905 mm

  • Memory Density:

    65536 bit

  • Memory IC Type:

    FRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Number of Words:

    8192 words

  • Number of Words Code:

    8000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    8KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP28,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.67 mm

  • Standby Current-Max:

    0.00005 A

  • Standby Voltage-Min:

    2.7 V

  • Supply Current-Max:

    0.012 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Pure Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.505 mm

FM16W08-SG Frequently Asked Questions (FAQs)

  • Infineon recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently.
  • Use a heat sink, ensure good airflow, and consider derating the device's power handling at high temperatures (above 85°C).
  • The absolute maximum rating for VCC is 6.5V, but operation above 5.5V is not recommended for reliable operation.
  • Yes, the device has a low quiescent current (IQ) of 10mA, making it suitable for battery-powered applications.
  • Use TVS diodes or other protection devices on the input pins to prevent EOS damage.

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FM16W08-SG Overview

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FRAM, 8KX8, Parallel, PDSO28