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FM22LD16-55-BG - Infineon

Description: F-RAM 4M (256Kx16) 55ns F-RAM

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PCB Footprints
FM22LD16-55-BG - Infineon PCB footprint - BGA - BGA - 48-ball FBGA (6 mm × 8 mm × 1.2 mm)
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3D Models
FM22LD16-55-BG - Infineon  - 3D model - BGA - 48-ball FBGA (6 mm × 8 mm × 1.2 mm)
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FM22LD16-55-BG Details

  • Manufacturer Part Number:

    FM22LD16-55-BG

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    4.9

  • Access Time-Max:

    110 ns

  • Data Retention Time-Min:

    10

  • Endurance:

    100000000000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PBGA-B48

  • JESD-609 Code:

    e1

  • Length:

    8 mm

  • Memory Density:

    4194304 bit

  • Memory IC Type:

    FRAM

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Number of Words:

    262144 words

  • Number of Words Code:

    256000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    256KX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA48,6X8,30

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Parallel/Serial:

    PARALLEL

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.2 mm

  • Standby Current-Max:

    0.00027 A

  • Supply Current-Max:

    0.012 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.75 mm

  • Terminal Position:

    BOTTOM

  • Width:

    6 mm

  • Write Protection:

    SOFTWARE

FM22LD16-55-BG Frequently Asked Questions (FAQs)

  • Infineon recommends a PCB layout with a large copper area connected to the thermal pad to ensure good heat dissipation. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation at high temperatures, it is recommended to follow the thermal design guidelines, use a heat sink if necessary, and ensure good airflow around the device.
  • The maximum allowed voltage on the input pins is 5.5V, exceeding this voltage may damage the device.
  • Yes, the FM22LD16-55-BG is designed to operate in a wide range of humidity levels, but it's recommended to follow the recommended storage and handling guidelines to prevent moisture-related issues.
  • Check the power supply voltage, ensure the enable pin is properly configured, and verify the input voltage is within the recommended range. If issues persist, consult the application note or contact Infineon support.

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FM22LD16-55-BG Overview

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