Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to improve heat dissipation. A minimum of 10 thermal vias with a diameter of 0.3 mm is recommended.
Ensure proper heat sinking, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK, and follow the recommended PCB layout guidelines. Additionally, consider using a heat sink with a thermal resistance of less than 10 K/W.
Infineon recommends a soldering profile with a peak temperature of 260°C, a dwell time above 217°C of 60-90 seconds, and a cooling rate of 4-6°C/s. Refer to the Infineon soldering guide for more information.
Store the devices in their original packaging, away from direct sunlight and moisture. Avoid bending or flexing the leads, and handle the devices by the body, not the leads. Use anti-static packaging and follow ESD precautions during handling.
Use a curve tracer or a semiconductor parameter analyzer to measure the device's electrical characteristics. A thermal camera or an infrared thermometer can be used to measure the device's temperature.
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FM25040B-GTR Overview
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