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FM25040B-GTR - Infineon

Description: F-RAM 4Kb Serial SPI 5V FRAM

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PCB Footprints
FM25040B-GTR - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - FM25V02A-GTR
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3D Models
FM25040B-GTR - Infineon  - 3D model - Small Outline Packages - FM25V02A-GTR
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FM25040B-GTR Details

  • Manufacturer Part Number:

    FM25040B-GTR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    8

  • Additional Feature:

    2kv ESD available

  • Clock Frequency-Max (fCLK):

    20 MHz

  • Data Retention Time-Min:

    10

  • Endurance:

    100000000000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.889 mm

  • Memory Density:

    4096 bit

  • Memory IC Type:

    FRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Number of Words:

    512 words

  • Number of Words Code:

    512

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    512X8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.727 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.00001 A

  • Standby Voltage-Min:

    4.5 V

  • Supply Current-Max:

    0.004 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Pure Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.8985 mm

  • Write Protection:

    HARDWARE/SOFTWARE

FM25040B-GTR Frequently Asked Questions (FAQs)

  • Infineon recommends a 2-layer or 4-layer PCB with a thermal via array under the device to improve heat dissipation. A minimum of 10 thermal vias with a diameter of 0.3 mm is recommended.
  • Ensure proper heat sinking, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK, and follow the recommended PCB layout guidelines. Additionally, consider using a heat sink with a thermal resistance of less than 10 K/W.
  • Infineon recommends a soldering profile with a peak temperature of 260°C, a dwell time above 217°C of 60-90 seconds, and a cooling rate of 4-6°C/s. Refer to the Infineon soldering guide for more information.
  • Store the devices in their original packaging, away from direct sunlight and moisture. Avoid bending or flexing the leads, and handle the devices by the body, not the leads. Use anti-static packaging and follow ESD precautions during handling.
  • Use a curve tracer or a semiconductor parameter analyzer to measure the device's electrical characteristics. A thermal camera or an infrared thermometer can be used to measure the device's temperature.

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FM25040B-GTR Overview

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