FM25L16B-DG - Infineon

FM25L16B-DG Details

• Manufacturer Part Number:

  FM25L16B-DG

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• Manufacturer:

  Infineon Technologies AG

• YTEOL:

  8

• Additional Feature:

  DATA RETENTION TIME @ 85 DEGREE CENTIGRADE

• Clock Frequency-Max (fCLK):

  20 MHz

• Data Retention Time-Min:

  10

• Endurance:

  100000000000000 Write/Erase Cycles

• JESD-30 Code:

  R-PDSO-N8

• JESD-609 Code:

  e3

• Length:

  4.5 mm

• Memory Density:

  16384 bit

• Memory IC Type:

  FRAM

• Memory Width:

  8

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Terminals:

  8

• Number of Words:

  2048 words

• Number of Words Code:

  2000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  2KX8

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  HVSON

• Package Equivalence Code:

  SOLCC8,.16,37

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

• Parallel/Serial:

  SERIAL

• Peak Reflow Temperature (Cel):

  260

• Seated Height-Max:

  0.8 mm

• Serial Bus Type:

  SPI

• Standby Current-Max:

  0.000006 A

• Standby Voltage-Min:

  2.7 V

• Supply Current-Max:

  0.003 mA

• Supply Voltage-Max (Vsup):

  3.6 V

• Supply Voltage-Min (Vsup):

  2.7 V

• Supply Voltage-Nom (Vsup):

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Terminal Finish:

  Pure Tin (Sn)

• Terminal Form:

  NO LEAD

• Terminal Pitch:

  0.95 mm

• Terminal Position:

  DUAL

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  4 mm

• Write Protection:

  HARDWARE/SOFTWARE