The recommended land pattern for FMP100JT-52-10R is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
Yes, FMP100JT-52-10R is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated and that the operating conditions do not exceed the maximum ratings specified in the datasheet.
To prevent damage, handle FMP100JT-52-10R by the edges or the body, avoiding touching the terminations. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending, flexing, or applying excessive force to the component during assembly.
The recommended soldering profile for FMP100JT-52-10R is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
Yes, FMP100JT-52-10R is designed for high-reliability and long-term stability applications. It has a low temperature coefficient of resistance (TCR) and is constructed with a stable metal film element, ensuring consistent performance over time and temperature.
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FMP100JT-52-10R Overview
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