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FMP300FRF73-1M - Yageo Group

Description: Metal Film Resistors - Through Hole 1 MOhms 3 W 1 % Axial

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FMP300FRF73-1M - Yageo Group - PCB symbol
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PCB Footprints
FMP300FRF73-1M - Yageo Group PCB footprint - Resistors, Axial Diameter Horizontal Mounting - Resistors, Axial Diameter Horizontal Mounting - FMP300
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3D Models
FMP300FRF73-1M - Yageo Group - 3D model - Resistors, Axial Diameter Horizontal Mounting - FMP300
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FMP300FRF73-1M Details

  • Manufacturer Part Number:

    FMP300FRF73-1M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    AXIAL LEADED

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.90

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    8

  • Additional Feature:

    FLAME PROOF

  • Construction:

    Tubular

  • JESD-609 Code:

    e3

  • Lead Diameter:

    0.8 mm

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Diameter:

    5 mm

  • Package Length:

    15.5 mm

  • Package Shape:

    CYLINDRICAL PACKAGE

  • Package Style:

    Axial

  • Packing Method:

    TR, 12 INCH

  • Rated Power Dissipation (P):

    3 W

  • Rated Temperature:

    70 °C

  • Resistance:

    1000000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Surface Mount:

    NO

  • Technology:

    METAL FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Shape:

    WIRE

  • Tolerance:

    1%

  • Working Voltage:

    750 V

FMP300FRF73-1M Frequently Asked Questions (FAQs)

  • The recommended land pattern for FMP300FRF73-1M is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • Yes, FMP300FRF73-1M is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated and that the operating conditions do not exceed the maximum ratings specified in the datasheet.
  • Yes, FMP300FRF73-1M is compatible with lead-free soldering processes. The component is RoHS-compliant and can be soldered using lead-free solder alloys with a peak reflow temperature of 260°C.
  • The MSL of FMP300FRF73-1M is MSL 2, which means that the component can be exposed to a maximum of 30°C/60% RH for 24 hours before soldering. It's essential to follow proper storage and handling procedures to prevent moisture absorption.
  • Yes, FMP300FRF73-1M is designed for high-frequency applications and has a self-resonant frequency of 100 MHz. However, it's essential to ensure that the component is properly decoupled and that the operating frequency does not exceed the maximum ratings specified in the datasheet.

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FMP300FRF73-1M Overview

Use the download button to access the FMP300FRF73-1M schematic symbol, PCB footprint, and 3D model.
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