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FMS6146MTC14X - onsemi

Description: Last Shipments - Video Filter Driver, Ultra Portable

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FMS6146MTC14X - onsemi - PCB symbol
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FMS6146MTC14X - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - FMS6146MTC14X
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FMS6146MTC14X Details

  • Manufacturer Part Number:

    FMS6146MTC14X

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TSSOP-14 WB

  • Package Description:

    TSSOP-14

  • Manufacturer Package Code:

    948G

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Current-Max:

    55 mA

  • Supply Voltage-Max (Vsup):

    5.25 V

  • Supply Voltage-Min (Vsup):

    4.75 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

FMS6146MTC14X Frequently Asked Questions (FAQs)

  • A good PCB layout should ensure minimal thermal resistance, use thermal vias, and keep high-current paths short. A heat sink or thermal pad is recommended to dissipate heat. Consult onsemi's application notes and thermal management guidelines for more information.
  • Implement proper overvoltage protection (OVP) and electrostatic discharge (ESD) protection circuits. Use TVS diodes or zener diodes for OVP, and follow onsemi's ESD protection guidelines. Ensure the device is handled and stored in an ESD-safe environment.
  • Use low-ESR, high-frequency capacitors (e.g., ceramic or film capacitors) with values between 1-10uF for input and output filtering. The specific capacitor values and types may vary depending on the application and operating conditions. Consult onsemi's application notes for more information.
  • Minimize parasitic inductance and capacitance in the PCB layout, use a low-impedance power supply, and ensure proper decoupling. Optimize the gate drive circuitry and consider using a gate driver IC. Consult onsemi's high-frequency application notes for more information.
  • The device's power rating decreases with increasing temperature. Consult onsemi's thermal derating charts and application notes to determine the maximum power rating at a given temperature. Ensure proper thermal management and heat dissipation to prevent overheating.

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FMS6146MTC14X Overview

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