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FMS6363CSX - onsemi

Description: Three Sixth-order 30MHz (HD) Filters ƒ Transparent Input Clamping ƒ Single Video Drive Load (2Vpp, 150Ω = 6δβ) ƒ AC or DC-coupled Inputs ƒ AC or DC-coupled Outputs ƒ DC-coupled Outputs Eliminate AC-coupling Capacitors ƒ 5V Only ƒ Robust 8kV ESD Protection ƒ Package SOIC-8

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PCB Footprints
FMS6363CSX - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - 8-SOIC*
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FMS6363CSX - onsemi  - 3D model - Small Outline Packages - 8-SOIC*
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FMS6363CSX Details

  • Manufacturer Part Number:

    FMS6363CSX

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOIC-8

  • Manufacturer Package Code:

    751EB

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    30 mA

  • Supply Voltage-Max (Vsup):

    5.25 V

  • Supply Voltage-Min (Vsup):

    4.75 V

  • Surface Mount:

    YES

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    NICKEL PALLADIUM GOLD SILVER

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

FMS6363CSX Frequently Asked Questions (FAQs)

  • A good PCB layout should ensure minimal thermal resistance, use a solid ground plane, and keep the device away from high-current paths. A heat sink or thermal pad can be used to improve thermal management. Consult onsemi's application notes and layout guidelines for more information.
  • Follow onsemi's recommended operating conditions, ensure proper thermal management, and consider using a heat sink or thermal pad. Also, consider derating the device's power handling capabilities at higher temperatures to prevent overheating.
  • The FMS6363CSX has built-in ESD protection, but handling precautions are still necessary. Use an ESD wrist strap, mat, or workstation, and avoid touching the device's pins or exposed internal components. Follow onsemi's ESD handling guidelines for more information.
  • Yes, the FMS6363CSX can be used in switching regulator applications. However, ensure that the device is properly biased, and the switching frequency is within the recommended range. Consult onsemi's application notes and design guidelines for more information.
  • Consult onsemi's troubleshooting guides and application notes for common issues. Check the PCB layout, thermal management, and component selection. Use oscilloscopes and other diagnostic tools to identify the root cause of the issue.

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FMS6363CSX Overview

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