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FNA25060 - onsemi

Description: 600 V - 50 A 3-Phase IGBT Inverter, Including Control ICs for Gate Drive and Protections; Built-In Bootstrap Diodes and Dedicated Vs Pins Simplify PCB Layout; Separate Open-Emitter Pins from Low-Side IGBTs for Three-Phase Current Sensing; Isolation Rating of 2500 Vrms / 1 min.; Very Low Thermal Resistance Using Al2O3 DBC Substrate; Low-Loss, Short-Circuit-Rated IGBTs; Adjustable Over-Current Protection via Integrated Sense-IGBTs; Built-In NTC Thermistor for Temperature Monitoring and Management; Single-Grou

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Symbol
FNA25060 - onsemi - PCB symbol
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PCB Footprints
FNA25060 - onsemi PCB footprint - Other - Other - SPMCA−A34 / 34LD, PDD STD, DBC DIP TYPE CASE MODFQ ISSUE O
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3D Models
FNA25060 - onsemi - 3D model - Other - SPMCA−A34 / 34LD, PDD STD, DBC DIP TYPE CASE MODFQ ISSUE O
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FNA25060 Details

  • Manufacturer Part Number:

    FNA25060

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP-034

  • Package Description:

    Module-34

  • Manufacturer Package Code:

    MODFQ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • Analog IC - Other Type:

    AC MOTOR CONTROLLER

  • JESD-30 Code:

    R-XDMA-T34

  • JESD-609 Code:

    e3

  • Length:

    80 mm

  • Number of Functions:

    1

  • Number of Terminals:

    34

  • Output Current-Max:

    100 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DMA

  • Package Shape:

    RECTANGULAR

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Seated Height-Max:

    8.1 mm

  • Supply Voltage-Max (Vsup):

    16.5 V

  • Supply Voltage-Min (Vsup):

    14 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    DUAL

  • Width:

    33 mm

FNA25060 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature (TJ) and ensure it stays within the recommended range.
  • A 10-22 μF X7R or X5R ceramic capacitor is recommended for the input filter. The capacitor should be placed as close to the device as possible and have a low ESL (Equivalent Series Inductance).
  • Use a shielded enclosure, keep the PCB layout compact, and use a common-mode choke or ferrite bead on the input lines. Ensure proper grounding and decoupling of the device.
  • The maximum allowed voltage drop is 0.5 V. Ensure the input voltage is within the recommended range, and the output voltage is within the specified regulation range.

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FNA25060 Overview

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