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FNB34060T - onsemi

Description: 600 V - 40 A 3-Phase IGBT Inverter with Integral Gate Drivers and Protection; Low-Loss, Short-Circuit Rated IGBTs; LVIC Temperature-Sensing Built-In for Temperature Monitoring; Built-In Bootstrap Diodes and Dedicated Vs Pins Simplify PCB Layout; Very Low Thermal Resistance using Al2O3 DBC Substrate; Single-Grounded Power Supply; Separate Open-Emitter Pins from Low-Side IGBTs for Three-Phase Current Sensing; Isolation Rating: 2500 Vrms / 1 min.

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Symbol
FNB34060T - onsemi - PCB symbol
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PCB Footprints
FNB34060T - onsemi PCB footprint - Other - Other - SPMMF-027
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3D Models
FNB34060T - onsemi - 3D model - Other - SPMMF-027
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FNB34060T Details

  • Manufacturer Part Number:

    FNB34060T

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP-027

  • Package Description:

    SPM-27

  • Manufacturer Package Code:

    MODFJ

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • Analog IC - Other Type:

    AC MOTOR CONTROLLER

  • JESD-30 Code:

    R-XDFM-T27

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    27

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    80 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DFM

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Supply Voltage-Max (Vsup):

    16.5 V

  • Supply Voltage-Min (Vsup):

    14 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    DUAL

FNB34060T Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Monitor the device's junction temperature (TJ) and adjust the operating conditions accordingly.
  • A low-ESR ceramic capacitor (e.g., X5R or X7R) with a value between 4.7 μF to 10 μF is recommended. The capacitor should be placed close to the VIN pin to minimize noise and ensure stable operation.
  • Use a shielded inductor, keep the layout compact, and minimize loop areas. Ensure proper grounding and decoupling, and consider adding EMI filters or shielding to the PCB design.
  • A low-ESR ceramic capacitor (e.g., X5R or X7R) with a value between 10 μF to 22 μF is recommended. The capacitor should be placed close to the VOUT pin to minimize noise and ensure stable operation.

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FNB34060T Overview

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