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FNB35060T6S - onsemi

Description: 600 V - 50 A 3-Phase IGBT Inverter with Integral Gate Drivers and Protection; Low-Loss, Short-Circuit Rated IGBTs; Built-In Bootstrap Diodes and Dedicated Vs Pins Simplify PCB Layout; Separate Open-Emitter Pins from Low-Side IGBTs for Three-Phase Current Sensing; Single-Grounded Power Supply; LVIC Temperature-Sensing Built-In for Temperature Monitoring; Isolation Rating: 2500 Vrms / 1 min.; Very Low Thermal Resistance using AlN DBC Substrate

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PCB Footprints
FNB35060T6S - onsemi PCB footprint - Other - Other - SPMQA−027 / 27LD, PDD STD, DBC DOUBLE DIP TYPE CASE MODDZ ISSUE O_2025
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3D Models
FNB35060T6S - onsemi  - 3D model - Other - SPMQA−027 / 27LD, PDD STD, DBC DOUBLE DIP TYPE CASE MODDZ ISSUE O_2025
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FNB35060T6S Details

  • Manufacturer Part Number:

    FNB35060T6S

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SPMQA-027 / 27LD, PDD STD, DBC DOUBLE DIP TYPE

  • Manufacturer Package Code:

    MODDZ

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Analog IC - Other Type:

    AC MOTOR CONTROLLER

  • JESD-609 Code:

    e3

  • Terminal Finish:

    Matte Tin (Sn) - annealed

FNB35060T6S Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves using a 2-layer or 4-layer board with a solid ground plane, placing thermal vias under the device, and using a thermal pad on the bottom side of the board. Additionally, keeping the PCB traces away from the device's thermal pad and using a thermal interface material (TIM) can help improve thermal performance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Proper thermal design, including a suitable heat sink and thermal interface material, can help keep the device within the recommended temperature range. Additionally, derating the device's power dissipation at high temperatures can help prevent overheating.
  • The FNB35060T6S has built-in ESD protection, but it's still essential to follow proper ESD handling procedures during assembly and testing. This includes using ESD-safe materials, grounding personnel and equipment, and avoiding direct contact with the device's pins. Additionally, using ESD protection devices, such as TVS diodes, can provide extra protection for the device.
  • To troubleshoot issues with the FNB35060T6S, start by verifying the device's operating conditions, including the input voltage, current, and temperature. Check for any signs of physical damage, such as cracks or burn marks, and ensure that the device is properly soldered to the PCB. Use oscilloscopes or logic analyzers to monitor the device's output and input signals, and consult the datasheet and application notes for guidance on troubleshooting specific issues.
  • The recommended storage and handling procedures for the FNB35060T6S include storing the devices in their original packaging, away from direct sunlight and moisture. Avoid bending or flexing the leads, and handle the devices by the body, rather than the leads. Use anti-static bags or containers to store the devices, and follow proper ESD handling procedures during assembly and testing.

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FNB35060T6S Overview

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