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FNB41560 - onsemi

Description: Single-grounded power supply with bootstrap operations; Isolation rating of 2000Vrms/min.; Built-in thermistor for temperature monitoring; Three separate open-emitter pins from low side IGBTs for three leg current sensing; 600V, 15A 3-phase IGBT inverter including control ICs for gate drive and protections; Easy PCB layout thanks to the built-in bootstrap diodes and the dedicated Vs pins

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Symbol
FNB41560 - onsemi - PCB symbol
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PCB Footprints
FNB41560 - onsemi PCB footprint - Other - Other - FNB41560-3
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3D Models
FNB41560 - onsemi - 3D model - Other - FNB41560-3
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FNB41560 Details

  • Manufacturer Part Number:

    FNB41560

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    CDIP-026

  • Package Description:

    SPM-26

  • Manufacturer Package Code:

    MODFA

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    3

  • Analog IC - Other Type:

    AC MOTOR CONTROLLER

  • JESD-30 Code:

    R-XDFM-T26

  • JESD-609 Code:

    e3

  • Length:

    39 mm

  • Number of Functions:

    1

  • Number of Terminals:

    26

  • Output Current-Max:

    22 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DFM

  • Package Equivalence Code:

    MODULE,26LEAD,1.1

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    6.5 mm

  • Supply Current-Max (Isup):

    3.65 mA

  • Supply Voltage-Max (Vsup):

    16.5 V

  • Supply Voltage-Min (Vsup):

    13.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    DUAL

  • Width:

    23 mm

FNB41560 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system design accordingly.
  • Monitor the device's current, voltage, and temperature. Implement overcurrent protection (OCP), overvoltage protection (OVP), and thermal shutdown (TSD) to prevent damage and ensure safe operation.
  • Use a gate driver with a high current capability (>1A) and a low output impedance. Ensure the gate drive circuit is properly decoupled and has a low inductance path to the device.
  • A dead time of 100-200 ns is recommended to prevent shoot-through and ensure reliable operation. However, the optimal dead time may vary depending on the specific application and system design.

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FNB41560 Overview

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FNB41560 Alternates

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Part Image FNB41560 Fairchild Semiconductor Corporation

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