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FNB43060T2 - onsemi

Description: UL Certified No. E209204 (UL1557); Low−Loss, Short−Circuit Rated IGBTs; Built−In Bootstrap Diodes and Dedicated Vs Pins Simplify PCB Layout; Built−In NTC Thermistor for Temperature Monitoring; Separate Open−Emitter Pins from Low−Side IGBTs for Three−Phase Current Sensing; Low Thermal Resistance Using Ceramic Substrate; 600 V − 30 A 3−Phase IGBT Inverter with Integral Gate Drivers and Protection; Single−Grounded Power Supply; Isolation Rating: 2000 Vrms/ min.

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Symbol
FNB43060T2 - onsemi - PCB symbol
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PCB Footprints
FNB43060T2 - onsemi PCB footprint - Other - Other - SPMAA−C26 / 26LD, PDD STD CERAMIC TYPE, LONG LEAD DUAL FORM TYPE CASE MODFC
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3D Models
FNB43060T2 - onsemi - 3D model - Other - SPMAA−C26 / 26LD, PDD STD CERAMIC TYPE, LONG LEAD DUAL FORM TYPE CASE MODFC
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FNB43060T2 Details

  • Manufacturer Part Number:

    FNB43060T2

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    CDIP-026

  • Package Description:

    SPM-26

  • Manufacturer Package Code:

    MODFC

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    11 Weeks

  • Manufacturer:

    onsemi

  • Additional Feature:

    CONTROL SUPPLY VOLTAGE(VCC)= 15V

  • Analog IC - Other Type:

    AC MOTOR CONTROLLER

  • JESD-30 Code:

    R-XDFM-T26

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    26

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    60 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DFM

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Supply Voltage-Max (Vsup):

    400 V

  • Supply Voltage-Nom (Vsup):

    300 V

  • Surface Mount:

    NO

  • Technology:

    HYBRID

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    DUAL

FNB43060T2 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Monitor the device's junction temperature (TJ) and adjust the operating conditions accordingly.
  • The maximum allowed voltage on the VIN pin is 36V, but it's recommended to keep it below 30V for reliable operation and to prevent damage to the internal voltage regulator.
  • Yes, the FNB43060T2 is designed for high-reliability applications. However, it's essential to follow proper design and manufacturing guidelines, and to implement adequate fault detection and correction mechanisms.
  • Use a systematic approach to troubleshoot issues. Check the power supply, input voltage, and output voltage. Verify the PCB layout and thermal design. Consult the datasheet and application notes for guidance.

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FNB43060T2 Overview

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