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FOD8001 - onsemi

Description: PSR in excess of 10% of the supply voltages across full operating bandwidth; 20kV/µs Minimum Static CMR @ Vcm = 1000V; Industrial fieldbus communications; 3.3V and 5V CMOS Compatibility; UL1577, 3750 VACRMS for 1 min.; Isolated Data Acquisition System; Profibus, DeviceNet, CAN, RS485; 6ns max. Pulse Width Distortion; 20ns max. Propagation Delay Skew; Programmable Logic Control; Safety and regulatory pending approvals:; 25Mbit/sec Date Rate (NRZ); 40ns max. Propagation Delay; 25kV/µs Typical Dynamic CMR @ Vc

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FOD8001 - onsemi - PCB symbol
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PCB Footprints
FOD8001 - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - Small Outline 8-pin
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3D Models
FOD8001 - onsemi - 3D model - Small Outline Packages - Small Outline 8-pin
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FOD8001 Details

  • Manufacturer Part Number:

    FOD8001

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC-8

  • Manufacturer Package Code:

    751DZ

  • Country Of Origin:

    Thailand

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Analog IC - Other Type:

    ANALOG CIRCUIT

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.88 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.63 mm

  • Supply Voltage-Max (Vsup):

    5 V

  • Supply Voltage-Min (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.91 mm

FOD8001 Frequently Asked Questions (FAQs)

  • A good PCB layout for FOD8001 involves keeping the input and output traces as short as possible, using a solid ground plane, and minimizing the distance between the photodiode and the amplifier. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure EMC with FOD8001, use a shielded cable for the input, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead on the output to reduce EMI.
  • The maximum allowable voltage on the VCC pin of FOD8001 is 5.5V. Exceeding this voltage may damage the device.
  • While FOD8001 is optimized for use with the SFH 203 photodiode, it can be used with other photodiodes. However, the performance may vary, and the user must ensure the photodiode is compatible with the amplifier's input stage.
  • To troubleshoot issues with FOD8001, check the power supply voltage, ensure proper PCB layout, verify the input signal, and check for soldering or assembly errors. Consult the datasheet and application notes for more information.

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FOD8001 Overview

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