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FOD817A300W - onsemi

Description: Current Transfer Ratio in Selected Groups:; FOD814: 20-300%; FOD817B: 130-260%; Safety and Regulatory Approvals; FOD817C: 200-400%; FOD817A: 80-160%; UL1577, 5,000 VACRMS for 1 Minute; FOD817: 50-600%; Minimum BVCEO of 70 V Guaranteed; FOD814A: 50-150%; AC Input Response (FOD814); FOD817D: 300-600%; DIN EN/IEC60747-5-5

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FOD817A300W - onsemi - PCB symbol
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FOD817A300W - onsemi PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - PDIP4 4.6x6.5, 2.54P CASE 646CA ISSUE O
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FOD817A300W - onsemi - 3D model - Dual-In-Line Packages - PDIP4 4.6x6.5, 2.54P CASE 646CA ISSUE O
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FOD817A300W Details

  • Manufacturer Part Number:

    FOD817A300W

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PDIP-4

  • Package Description:

    DIP-4

  • Manufacturer Package Code:

    646CA

  • Country Of Origin:

    Thailand

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    UL APPROVED, VDE APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    70 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    80%

  • Current Transfer Ratio-Nom:

    80%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.05 A

  • Forward Voltage-Max:

    1.4 V

  • Isolation Voltage-Max:

    5000 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.05 A

  • Operating Temperature-Max:

    110 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Packing Method:

    TUBE

  • Power Dissipation-Max:

    0.15 W

  • Response Time-Max:

    0.000018 s

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

FOD817A300W Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended. Additionally, thermal vias can be used to further improve heat dissipation.
  • To ensure reliability, it is essential to follow the recommended derating curves for the device. The maximum junction temperature (Tj) should not exceed 150°C. Additionally, the device should be operated within the recommended operating conditions, and adequate heat sinking should be provided.
  • The FOD817A300W has an integrated ESD protection diode, but it is still recommended to follow proper ESD handling procedures during assembly and testing. A minimum of HBM (Human Body Model) 2kV and MM (Machine Model) 200V ESD protection is recommended.
  • Yes, the FOD817A300W is suitable for high-frequency switching applications. However, it is essential to consider the device's switching characteristics, such as rise and fall times, and ensure that the device is operated within its recommended frequency range.
  • The gate resistor value depends on the specific application requirements, such as switching frequency and voltage. A general guideline is to use a gate resistor value between 10Ω to 100Ω. However, it is recommended to consult the application note or consult with an onsemi representative for specific guidance.

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FOD817A300W Overview

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