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FOD817C300 - onsemi

Description: FOD817C: 200-400%; Minimum BVCEO of 70 V Guaranteed; FOD817B: 130-260%; FOD817D: 300-600%; FOD814: 20-300%; Safety and Regulatory Approvals; FOD814A: 50-150%; Current Transfer Ratio in Selected Groups:; UL1577, 5,000 VACRMS for 1 Minute; FOD817A: 80-160%; FOD817: 50-600%; DIN EN/IEC60747-5-5; AC Input Response (FOD814)

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FOD817C300 - onsemi - PCB symbol
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FOD817C300 - onsemi PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - DIP 4-Pin
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FOD817C300 - onsemi - 3D model - Dual-In-Line Packages - DIP 4-Pin
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FOD817C300 Details

  • Manufacturer Part Number:

    FOD817C300

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PDIP-4

  • Package Description:

    DIP-4

  • Manufacturer Package Code:

    646CD

  • Country Of Origin:

    Thailand

  • HTS Code:

    8541.40.80.00

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    UL APPROVED, VDE APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    70 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    200%

  • Current Transfer Ratio-Nom:

    200%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.05 A

  • Forward Voltage-Max:

    1.4 V

  • Isolation Voltage-Max:

    5000 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.05 A

  • Operating Temperature-Max:

    110 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Packing Method:

    TUBE

  • Power Dissipation-Max:

    0.15 W

  • Response Time-Max:

    0.000018 s

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

FOD817C300 Frequently Asked Questions (FAQs)

  • A good PCB layout for FOD817C300 involves keeping the input and output traces separate, using a ground plane, and minimizing the length of the traces to reduce electromagnetic interference (EMI).
  • To ensure proper biasing, connect the enable pin (EN) to a voltage source (e.g., VCC) through a resistor, and connect the input pin (IN) to a voltage source or a signal source. Consult the datasheet for specific biasing requirements.
  • The maximum operating frequency of the FOD817C300 is 100 MHz. However, the actual frequency limit may vary depending on the specific application and PCB layout.
  • To manage thermal issues, ensure good airflow around the device, use a heat sink if necessary, and follow the recommended thermal design guidelines in the datasheet.
  • The FOD817C300 has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures when handling the device, such as using an ESD wrist strap or mat.

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FOD817C300 Overview

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