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FOD817C300W - onsemi

Description: FOD817C: 200-400%; Minimum BVCEO of 70 V Guaranteed; FOD817B: 130-260%; FOD817D: 300-600%; FOD814: 20-300%; Safety and Regulatory Approvals; FOD814A: 50-150%; Current Transfer Ratio in Selected Groups:; UL1577, 5,000 VACRMS for 1 Minute; FOD817A: 80-160%; FOD817: 50-600%; DIN EN/IEC60747-5-5; AC Input Response (FOD814)

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FOD817C300W - onsemi - PCB symbol
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PCB Footprints
FOD817C300W - onsemi PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - PDIP4 4.6x6.5, 2.54P
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FOD817C300W - onsemi - 3D model - Dual-In-Line Packages - PDIP4 4.6x6.5, 2.54P
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FOD817C300W Details

  • Manufacturer Part Number:

    FOD817C300W

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PDIP-4

  • Package Description:

    DIP-4

  • Manufacturer Package Code:

    646CA

  • Country Of Origin:

    Thailand

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    UL APPROVED, VDE APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    70 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    200%

  • Current Transfer Ratio-Nom:

    200%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.05 A

  • Forward Voltage-Max:

    1.4 V

  • Isolation Voltage-Max:

    5000 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.05 A

  • Operating Temperature-Max:

    110 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Packing Method:

    TUBE

  • Power Dissipation-Max:

    0.15 W

  • Response Time-Max:

    0.000018 s

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

FOD817C300W Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an inner layer or the backside of the PCB for better heat dissipation.
  • The FOD817C300W requires a bias voltage of 5V to 15V. Ensure the bias voltage is stable and within the recommended range. A decoupling capacitor (e.g., 100nF) should be placed close to the device to filter out noise and ensure stable operation.
  • The maximum allowable current through the output pins is 300mA. Exceeding this current may cause damage to the device or reduce its lifespan.
  • Use ESD protection devices (e.g., TVS diodes) on the input and output pins to protect against electrostatic discharge. Additionally, consider using overvoltage protection devices (e.g., zener diodes) to prevent damage from voltage spikes or surges.
  • The recommended storage temperature range for the FOD817C300W is -40°C to 125°C. Storing the device outside this range may affect its performance or lifespan.

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FOD817C300W Overview

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