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FOD817C3SD - onsemi

Description: FOD817C: 200-400%; Minimum BVCEO of 70 V Guaranteed; FOD817B: 130-260%; FOD817D: 300-600%; FOD814: 20-300%; Safety and Regulatory Approvals; FOD814A: 50-150%; Current Transfer Ratio in Selected Groups:; UL1577, 5,000 VACRMS for 1 Minute; FOD817A: 80-160%; FOD817: 50-600%; DIN EN/IEC60747-5-5; AC Input Response (FOD814)

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FOD817C3SD - onsemi - PCB symbol
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FOD817C3SD - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - 4-PIN SMD DIP
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FOD817C3SD Details

  • Manufacturer Part Number:

    FOD817C3SD

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PDIP-4 GW

  • Manufacturer Package Code:

    709AH

  • Country Of Origin:

    Thailand

  • HTS Code:

    8541.40.80.00

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Additional Feature:

    UL APPROVED, VDE APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    70 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    200%

  • Current Transfer Ratio-Nom:

    200%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.05 A

  • Forward Voltage-Max:

    1.4 V

  • Isolation Voltage-Max:

    5000 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.05 A

  • Operating Temperature-Max:

    110 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Packing Method:

    TR

  • Power Dissipation-Max:

    0.15 W

  • Response Time-Max:

    0.000018 s

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

FOD817C3SD Frequently Asked Questions (FAQs)

  • A good PCB layout for FOD817C3SD involves keeping the input and output traces separate, using a ground plane, and minimizing the length of the traces to reduce electromagnetic interference (EMI).
  • To ensure reliability in high-temperature applications, it's essential to follow the recommended operating temperature range, use a suitable heat sink, and ensure good thermal conductivity between the device and the heat sink.
  • FOD817C3SD has built-in ESD protection, but it's still important to follow proper handling and storage procedures to prevent ESD damage. Use an anti-static wrist strap, mat, or storage container, and avoid touching the device's pins.
  • Yes, FOD817C3SD can be used in switching power supply applications due to its high-speed switching capability and low power consumption. However, ensure that the device is properly biased and that the output is properly filtered to minimize electromagnetic interference (EMI).
  • To troubleshoot issues with FOD817C3SD, start by checking the PCB layout, ensuring that the input and output traces are separate and that the device is properly biased. Also, verify that the output is properly filtered and that the device is operating within its recommended specifications.

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FOD817C3SD Overview

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