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FODM121R2V - onsemi

Description: More than 5mm Creepage/Clearance; Current Transfer Ratio in Selected Groups DC Input: FODM121: 50–600% FODM121A: 100–300% FODM121B: 50–150% FODM121C: 100–200% FODM124: 100% MIN FODM2701: 50–300% AC Input: FODM2705: 50–300%; Compact 4-Pin Surface Mount Package (2.4mm Maximum Standoff Height); Safety and Regulatory Approvals: ♦ UL1577, 3,750 VACRMS for 1 Minute ♦ DIN−EN/IEC60747−5−5, 565 V Peak Working Insulation Voltage

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FODM121R2V - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - 4-PIN SMD
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FODM121R2V - onsemi  - 3D model - Small Outline Packages - 4-PIN SMD
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FODM121R2V Details

  • Manufacturer Part Number:

    FODM121R2V

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MFP-4

  • Manufacturer Package Code:

    100AP

  • Country Of Origin:

    Thailand

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    8

  • Additional Feature:

    UL APPROVED, VDE APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    80 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    50%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.05 A

  • Forward Voltage-Max:

    1.3 V

  • Isolation Voltage-Max:

    3750 V

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • Operating Temperature-Max:

    110 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Packing Method:

    TR

  • Power Dissipation-Max:

    0.15 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

FODM121R2V Frequently Asked Questions (FAQs)

  • A good PCB layout for FODM121R2V involves keeping the input and output traces separate, using a ground plane, and minimizing the length of the traces to reduce parasitic inductance and capacitance.
  • To ensure proper biasing, connect the VCC pin to a stable voltage source, and the GND pin to a solid ground plane. The input voltage should be within the recommended range, and the output should be terminated with a suitable load impedance.
  • The maximum power dissipation of FODM121R2V is 1.4W. To prevent overheating, ensure good airflow, use a heat sink if necessary, and keep the device within the recommended operating temperature range (-40°C to 150°C).
  • Use ESD protection devices, such as TVS diodes, and overvoltage protection circuits, such as voltage regulators, to prevent damage from electrostatic discharge and voltage surges.
  • Store FODM121R2V in a dry, cool place, away from direct sunlight and moisture. Handle the device by the body, avoiding touching the pins, and use anti-static wrist straps or mats to prevent ESD damage.

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FODM121R2V Overview

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